SMT Process Management

Process

With our many years of experience, SMT delivers customer satisfaction based on
our production technology, excellent quality, and price competitiveness.

Real-time management of the manufacturing process from raw material input to shipment based on MES (Manufacturing Execution System)

MES overall management process (material warehousing - product shipment): Computerized total management of the history of raw materials/finished products, including material release, warehousing and setting

History management of raw materials and finished products - Assigning unique material names to raw materials, tools, and products

1) Assignment of unique self-identification to warehousing materials

Unique material name assignment, traceability management for raw materials and solder paste
MES computerized management based on raw material MSL. Registration management of baking and repacking history
MES computerized management of solder paste. Expired paste cannot be used for production
MES computerized management of solder paste left at room temperature and viscosity measurement
Cannot be used for production if it falls below/exceeds the standard

2) Assignment and registration of unique codes for all tools in use

Metal mask, squeeze
Scan during production. Production is impossible where there is inconsistency with the work order (PO)
MES computerized management for the number of uses. Expired products cannot be used for production.

Adulteration preventive process (intensive management item): Materials unmatched to the work order cannot be released/produced (System Locking)

Reel swap error protect system

1) Issuance of work orders (PO) 2) Material release

Scanning material released from the materials department to the production department based on the work order
(Unable to scan where there is inconsistency between the work order and materials, System Locking)

3) Material production warehousing

Scanning warehousing at the production site based on the work order
(Unable to scan where there is inconsistency between the work order and materials, System Locking)

4) Material mounter facility setting

Unable to operate where there is inconsistency in raw material barcodes, feeder barcodes, and work order codes when setting or replacing materials (System Locking)
Able to check material unique number, date and time when setting or exchanging materials (history traceability)

Real-time check of process history

LOT tracking management

Defect history management: Able to check real-time production status
: Real-time check is available including production line-stop caused by self processing issues

Inventory management by warehouse

Manufacturing process facility

Screen printer facility

Facility Name	Screen Printer
Facility Overview	Automatic solder application facility
Facility Model	US-2000X
Facility Operation	Product loading → Solder application → Product unloading

Contents	Detailed description
PCB SIZE	50mmx50mm - 1200mm x 600mm
PCB thickness	0.1mm - 5mm
Stencil Size	550mm,650mm,736, 1500mm
Printing Speed	5~250mm/sec
Printing Force	0.1 ~ 25kgf
Crcle Time	10sec
Alignment accuracy	±12.5um @ 6 sigma
Printing repeatability	±25um @ 6 sigma . Cpk > 2.0
Power supply	Sphase AC220-240V, 50/60Hz 10amp
Air supply	4~6kg/㎠ (56~85psi), 0.13㎡ Volume

Key management items

Type	Applicable Model	Conditions
Printing pressure	LED BAR, Camera Module, Game Board	4kgf +2kg
Printing speed		60mm/sec± 30mm/sec
Plate separation speed		1mm/sec ± 0.5mm/sec
Plate separation distance		3mm/ sec ± 1mm/sec

3D SPI facility

Facility Name	3D SPI
Facility Overview	Automatic solder application inspector
Facility Model	Zenith
Facility Operation	Product loading → Solder inspection → Product unloading

Contents	Detailed description
Measurement items	Volume, area, height, XY position, bridge, shape, bird caging
Defect inspection items	Under-soldering, over-soldering, no-soldering, bridge, shape abnormality, poor positioning
Camera resolution	15um
FOV size	30X30mm (1.18 x 1.18 inch)
Inspection speed	38.1 ㎠ /sec
Height measuring accuracy	1um
Camera	10M Pixel high-speed camera
Maximum detection size	10x10mm
Maximum detection height	400um
PCB SIZE	1200X600mm

Key management items

Type	Applicable Model	Conditions
Volume	LED BAR, Camera Module, Game Board	100% ± 40
height		100um ± 30
area		100um ± 30
XY position		±0.1mm

Mounter facility

Facility Name	Ultrahigh speed MOUNTER
Facility Overview	Automatic mounting facility
Facility Model	NPM (PANASONIC)
Facility Operation	Product loading → Material mounting → Product unloading

Contents	Detailed description
Mounting speed	18,400 CPH ( 0.0195 s / chip)
Level of mounting	±0.025 mm
HEAD configuration	16 NOZZLE, 8 NOZZLE, 3 NOZZLE, 2 NOZZLE
Rated voltage	AC 200 / 220V
Rated capacity	5.0 KVA
Pneumatic AIR volume	200L/min
PCB size	50X50~1200 X 600mm
PCB thickness	0.3~8mm
Facility size	W1665 X D2570 X H1444

Key management items

Type	Applicable Model	Conditions
Material inspection	LED BAR, Camera Module Game Board	BAR CODE SCAN

3D AOI facility

Facility Name	3D AOI facility
Facility Overview	State inspection of automated mounting
Facility Model	Zenith
Facility Operation	Product loading → Mounting inspection → Product unloading

Contents	Detailed description
Light	IR - RGB LED DOME
Defect inspection items	Defect inspection items: Bridge, reverse insertion, overturning, under-soldering, small soldering, poor positioning
Camera resolution	15um
FOV size	40 X 40mm ( 1.57 x 1.57 inch )
Inspection speed	38.1 ㎠ / sec
Height measuring accuracy	1um
Camera	12M Pixel high-speed camera
Maximum detection size	50x50mm
Maximum detection height	50mm
PCB SIZE	1200 X 600mm

Key management items

Type	Applicable Model	Conditions
Under-soldering	LED BAR, Camera Module Game Board	None
Fillet		70% or more
reverse insertion		None
Under-soldering		None

N2 Reflow facility

Facility Name	N2 Reflow
Facility Overview	Soldering facility
Facility Model
Facility Operation	Product loading → Soldering → Product unloading

Contents	Detailed description
Board Width	50~550mm
Conveyor speed	25~188mm/min
Conveyor height	950
Equipment size	4650x1500x1600
Supply	380v, 3Phase, 4Wire, 60Hz
Max Temp	350°
Zone	12
Cooling Zone	2
Cooling Temp	80℃ - 90℃
Temperature Control	Independent PID

Key management items

Type	Applicable Model	Conditions
Profile temperature measuring	LED BAR, Camera Module Game Board	Once per day (when changing models)